All of the designs based on SMIC0.18um standard CMOS process. All of the designs are simulated in CADENCE environment.
所有设计基于SMIC0.18um标准CMOS工艺,采用在CADENCE环境下对运放进行了仿真,得到了满意的仿真结果。
参考来源 - CMOS高性能运算放大器研究与设计·2,447,543篇论文数据，部分数据来源于NoteExpress
This circuit structure is simple and can be realized by the standard CMOS process easily.
该电路结构简单，易于实现，且制作工艺与标准CMOS工艺完全兼容。
The design of the tungsten micro-hotplate can be applied to other thermal-based sensors in the standard CMOS process.
本文的钨微热板的设计可以应用到相关的与标准CMOS工艺兼容的热传感器的设计之中。
The simulating results have proved that the designed circuit has good characteristics. The circuit realized with the standard CMOS process has higher practical value.
仿真结果验证了电路具有良好特性，该电路采用标准CMOS工艺实现，具有较高的实用价值。
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