... 0201器件在生产过程中的主要缺陷：墓碑现象（Tombstone） 焊接架桥（Solder Bridging） 刷过程中的影响。在一块PCB上，可能有几百个元器件，600~1000个land（即焊盘pad）， ...
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Solder Bridging: Solder connecting, in most cases, misconnecting, two or more adjacent pads that come into contact to form a conductive path.
桥接：焊料连接，通常是导线间由焊料形成的多余的导电通路。
The solder resist prevents solder from bridging between conductors and thereby creating short circuits.
锡焊料从抵抗防止导体间，从而营造桥短路。
Historical data is combined with several Design of Experiments looking at solder defects like bridging and process optimizations to achieve the best hole filling.
过去的数据结合数个对于焊接不良有如桥接的实验设计和制程优化可达到最佳的通孔填充。
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