silver migration resistance
silver migration resistance
抗银迁移性
以上为机器翻译结果，长、整句建议使用 人工翻译 。
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The results show that there is not any evidence of silver migration within LTCC construction, and conductor adhesive force, wire-bonding strength and insulation resistance are high.
结果表明：基板内部的银导体不存在迁移现象，导体的附着力、键合强度以及基板的绝缘电阻等性能均比较理想。
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