The significance of sapphire wafer cleaning in growing of GaN is explained.

阐述了在氮化镓生长中使用的蓝宝石晶片净化的重要性。

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In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.

本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。

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Provided is a method for manufacturing a semiconductor light emitting element, by which a sapphire wafer can be divided into chips accurately at an extremely high yield.

本发明提供一种半导体发光元件的制造方法，使蓝宝石晶片形成芯片时，能够以极高的成品率正确地形成芯片。

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Under current manufacturing techniques, manufacturers take their sapphire or silicon carbide wafer and chop, or cut it into individual chips, which get tested and packaged.

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By switching from sapphire to silicon wafers, the wafer size jumps from two or four inches to eight inches.

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