A new process method, using open annulus distributed holes in place of ring trench as the lateral oxidation Windows, is reported to fabricate vertical-cavity surface emitting laser (VCSEL).
采用一种新工艺制作了垂直腔面发射激光器(VCSEL)，即用开环分布孔取代以往的环形沟道作为氧化物限制技术的注入窗口。
By using this method, the technique of laser cut - ring LCD glass substrates is studied both in fracture mechanism and experiment.
采用该技术，从断裂基理和实验验证两方面对激光切割液晶显示玻璃基片进行了一定的研究。
The temperature and stress fields of a ring structure laser welding are simulated by finite element method (FEM).
对铍环激光束钎焊过程的温度场和应力场进行了有限元模拟。
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