Area arrays present special process considerations when rework and repair is required.
面阵列封装对返工和修理提出了特殊的工艺要求。
Their weakness is in predicting requirements growth, design effort, documentation and management, testing, repair, and rework.
它们的弱点在于预期需求、设计、文档和管理工作、测试、维护和返工方面。
Complete inspection requirements, including lighting requirements and method of marking defects for rework or repair.
完整的检验要求，包括灯光要求和标记缺陷进行返修、重做的方法。
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