Because the height of micro tips on cathode surface can be eroded by the negative current, surface finishing is better in the micro-electroforming by periodic reverse pulse current than pulse current.

由于负向电流可以腐蚀削减铸层表面微观突起的生长高度，因此周期换向脉冲电流微电铸与单向正脉冲电流微电铸相比更易获得较好的铸层均匀性。

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