Microsoft Word - 45-p1978.DOC Key words: tinplate; alloy layer; reflowing process; galvanic corrosion [gap=36864]关键词：镀锡钢板；合金层；软熔处理；电偶腐蚀
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thermal reflowing process 热力再流动法
The packaging process of vacuum reflowing soldering using in MEMS micro-gyro packaging was built and realized.
实现了MEMS微陀螺仪的真空封装工艺并优化了工艺参数；
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