Design the stencil as common as possible when designing insert reflow soldering stencil, in order to brief technological process and meet better print effect.
在设计插件回流焊印刷模板时，应尽可能设计成普通模板以简化工艺流程和满足较好的印刷效果。
Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.
此外，利用有限元ansys软件对PC B组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了PC B组件再流焊全过程的三维动态模拟和仿真。
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