The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
The material is hopefully used as novel printed circuit board and package material of electronic components.
这样的材料在电子封装材料和印刷线路板中具有很大的应用前景。
应用推荐