The invention discloses a circuit board for reducing the area occupied by through holes during passing through a power supply layer.
本发明揭示一种线路板,用以减少贯孔通过电源层所占用的面积。
The circuit board comprises a plurality of circuit layers, one power supply layer, a plurality of insulating layers and one conducting pattern.
此线路板包括多个线路层、一电源层、多个绝缘层与一导电图案。
Best layout and performance are achieved with at least a 4-layer multilayer board, where there is a ground plane layer, a power supply layer, and two signal layers.
电路板至少需要4层才能实现最佳布局和性能:一个接地层、一个电源层和两个信号层。
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