... post-soldering cleaning 焊后清洗 post-CMP cleaning 需要适当的后清洗 Post Solder Semiqueous Cleaning Handbook 锡焊后半水溶剂清洗手册 ...
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The use of different barrier slurries for copper chemical mechanical planarization CMP creates a challenge for post-CMP cleaning.
铜化学机械平面化不同阻挡层浆料的应用引起了铜CMP后清洗的问题。
The selectivity, the chemical and mechanical function's matching, the storage of the slurry and post CMP cleaning ULSI inlaid tungsten CMP have been studied in this article.
研究的是ULSI镶嵌钨CMP的选择性，化学与机械作用匹配，浆料的悬浮及存放和后清洗等问题。
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