A wafer with poor surface quality has hidden risks of stress concentration and little cracks, which would cause a huge damage of bursting crack when dicing the wafer.
表面质量不好的晶圆会存在应力集中、裂缝等隐患，在分割晶圆片时，会导致晶圆崩裂的巨大损失。
Because of the effect of CPU-calculating speed, the procedure of machining is carried out point by point from calcuation to cutting intermittently , leading to poor surface quality on the workpiece.
通过反复改变工艺系统的参数，最终有效地提高了工件的表面质量，保证了工件的加工精度，从而在由工艺系统弥补编程系统的不足方面做了有益的尝试。
The crack is induced mainly by poor metallurgical quality of the shaft and the crack that occurred on the shaft surface before surface treatment.
零件冶金质量差，且表面处理前零件表面存在裂纹，是涡轮轴产生裂纹的原因。
应用推荐