... poor printed 印刷偏差 poor solderability 焊锡性不良 poor touch-up 补线不良 ...
基于59个网页-相关网页
·2,447,543篇论文数据，部分数据来源于NoteExpress
In view of the poor solderability of metallic film formed on ceramic surface, a secondary metallization of ceramic surface by nickel plating was advanced.
为提高陶瓷金属化层的焊接性能，提出了一种陶瓷二次金属化镀镍工艺。
youdao
应用推荐
模块上移
模块下移
不移动