...核心层之中，以加有玻璃纤维的树脂板为中心，再让绝缘层和铜镀金电路交织而成，此类构造需要使用电镀通孔(Plating Through Hole)，导致核心层的设计自由度降低。
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The technology of the plating through hole of the printed circuit board was briefly introduced the plating through hole technology of the microwave printed circuit board were also illuminated.
本文在简单介绍印制板孔金属化加工技术的基础上，对微波印制板孔金属化加工技术进行了较为详细的论述。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
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