Cu and Pb ions in the alloy plating bath and composition of its deposits.
此法已被成功应用于测定锡-铜-铅合金电镀液及其镀层中的锡、铜和铅。
Cholride ions in acid copper plating bath were determined by nephelometry with op emulsifier as stabilizer.
利用比浊法,以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
A method for continuous titration of boric acid and nickel chloride in bright nickel plating bath was presented.
介绍了一种光亮镀镍液中硼酸和氯化镍的测定方法。
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