At last the article proposes the designing strategy of board-level power distribution system, analyze the principle of decoupling, the method of choosing decoupling capacitors and their PCB designing.
文章最后提出了板级电源分配系统的设计策略，详细分析了去耦电容的原理，并介绍了去耦电容选取原则和PC B设计方法。
The results show that the viscoelasticity of PCB and its size have distinct influence on dynamic properties of PCB under board-level drop impact.
结果表明，电路板的黏性系数和尺寸对板的动力学特性有显著影响。
The study about board level drop impact shows that: (1) The mechanical impact and bending of PCB are the main reasons which induce the solder joint stress even the drop failure;
研究结果表明，在跌落冲击条件下：（1）PCB的机械冲击和弯曲变形是导致焊点应力甚至跌落失效的主要原因；
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