At last the article proposes the designing strategy of board-level power distribution system, analyze the principle of decoupling, the method of choosing decoupling capacitors and their PCB designing.

文章最后提出了板级电源分配系统的设计策略，详细分析了去耦电容的原理，并介绍了去耦电容选取原则和PC B设计方法。

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The study about board level drop impact shows that: (1) The mechanical impact and bending of PCB are the main reasons which induce the solder joint stress even the drop failure;

研究结果表明，在跌落冲击条件下：（1）PCB的机械冲击和弯曲变形是导致焊点应力甚至跌落失效的主要原因；

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