...ack To Via)、过孔与过孔(Via to Via)、导线 与焊盘(Track to Pad)、焊盘与焊盘(Pad to Pad)、 焊盘与过孔(Pad to Via)等之间的最小间距。一般 情况,我们可以选择8mil-12mil在有强电的情况下, 要将间距选大一些,避免被击穿。
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The prepared solution was used to treat cotton fabric via immerse, pad and bake, and processing parameter has been analysized and discussed.
再将该分散液经过浸、轧、烘整理工艺制得纳米氧化锌基棉织物。
When the electric signal is supplied to the driver circuit part, it is supplied via an electric signal supply pad.
经电气信号供应焊盘将电气信号供给到驱动电路部分。
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