packaging process of integrated circuit
... 申请人: Lingsen Precision Industries Ltd 代理人: zhou guocheng 发明名称: Packaging process of integrated circuit ...
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packaging process of integrated circuit
集成电路的封装工艺
以上为机器翻译结果，长、整句建议使用 人工翻译 。
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Integrated circuit packaging is a backend process of semiconductor industry. Due to the modeling diversification of assembly, process accuracy is required to higher quality.
积体电路封装为整个半导体产业后半段制程，然而封装的型式多样化，相对的制程精准度要求也越来越高。
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