At last, the trends of MEMS and MEMSpackaging are prospected, and the integrated MEMS system packaging is discussed.
最后对MEMS和MEMS封装的走向进行了展望，并对全集成MEMS系统的封装进行了一些探讨。
Failure analysis is conducted for the single chip packaging process of an advanced high-range MEMS accelerometer with double cantilever beams.
对一种先进的双悬臂梁高量程MEMS加速度计的单芯片封装工艺进行了失效机理分析。
The vacuum obtains and maintenance is still still the main problem in the field of MEMS vacuum packaging technology.
真空的获得和维持是目前MEMS真空封装技术中存在的主要难题之一。
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