The appliance of high speed multilayer board technology assures the quality of circuit board.
高速多层板布线技术的使用使电路板的质量得到了保证,性能得到了提高。
参考来源 - 嵌入式DSP多接口处理系统的设计·2,447,543篇论文数据,部分数据来源于NoteExpress
Today, all developments regarding rigid-multilayer board have been implemented to rigid-flex printed circuit boards.
今天,凡是在刚性多层板的技术进步,同样,在刚-挠性印制板也是能够实现的。
Best layout and performance are achieved with at least a 4-layer multilayer board, where there is a ground plane layer, a power supply layer, and two signal layers.
电路板至少需要4层才能实现最佳布局和性能:一个接地层、一个电源层和两个信号层。
Making Multilayer printed board has a complex working procedure and long period, then the reason of causing Void PTH is very complex.
多层印制板的制作是一个生产工序复杂且周期很长的过程,那么造成金属化孔镀层空洞的原因也就很复杂。
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