The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.

本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。

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The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.

图案化金属层位于绝缘层上并填入于导通孔中，以作为本实用新型多芯片封装结构的内连线层。

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