Multi-chip packaging ( MCP ) technologies and their basi status, state-of-art of applications for mobile phone memory are reviewed in this paper.

文章评述多芯片封装技术及目前的基本情况，这一技术在手机存储器的应用现状等。

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The invention discloses a multi-resistance state resistor random-access memory unit and a preparation method thereof, and belongs to the technical field of microelectronics.

本发明公开了一种多阻态电阻随机存储器单元及其制备方法，属于微电子技术领域。

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Intel announced a new SATA interface enterprise solid state drive (SSD) that uses 25 nm multi-level cell flash memory (this is 2 bit per cell technology referred to as MLC).

FORBES: New Technology and Investment Opportunities at the 2011 Intel Developers Forum