For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.
在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
Furthermore, the multi defect structure has greater tolerance of film thickness and incidence Angle.
同时这种多缺陷的结构对于膜层厚度的变化和入射角度也有很好的宽容性。
Several film structures such as double cut-off structure, F-P structure, multi-half-wave structure are given, and their bandwidth estimation formulas are concluded.
首先给出双截止组合型、F - P型、多半波型等几种膜系结构，归纳了相对带宽估算公式。
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