minimum thickness of single slice
... 可切割最大工件尺寸 MAX work size 最小切片厚度 Minimum thickness of single slice 供线轮储线量 Wire reel capacity ...
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minimum thickness of single slice
单片最小厚度
以上为机器翻译结果，长、整句建议使用 人工翻译 。
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The wire sawing process has been applied to slice single silicon into thin wafers for its character of minimum warp, uniform thickness and low kerf loss.
由于线锯切割具有切片薄、表面翘曲变形小、厚薄均匀和切口损失小等优点，被广泛用于单晶硅切片加工。
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