The microstructure of interface for Mg matrix composites with different enhances were summarized, and the optimization way of interface was discussed.
论述了采用不同增强物增强的镁基复合材料的界面微观结构，并对界面优化的方法进行了探讨。
The research on element interdiffusion, reaction and microstructure at the interface of solder joints is vital to the study of lead free solder joints reliability.
因此钎焊过程和服役过程中界面的反应、扩散以及界面的微观组织对当前无铝钎料可靠性研究具有重大意义。
By this way, the microstructure of corrosion products in macro-pores became compact and the destruction of corrosion medium to interface was inhibited.
通过这种方式，腐蚀产物在宏观孔隙中形成致密的微观结构，阻止腐蚀介质对界面的破坏。
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