Research progresses of laser trimming, laser drilling, laser cleaning, laser flexible routing and laser micro welding applied in the IC fabrication and packaging are given.
介绍了在集成电路制造封装中采用的激光微调、激光打孔、激光清洗、激光柔性布线和激光微焊技术。
The Welding Technology of lower power pulse YAG laser beam welding micro-module with filler wire was given.
给出了利用脉冲YAG激光做微型结构件的激光填丝焊接的较佳焊接工艺。
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