metal interconnection pattern [材] 金属互连图案
interconnection metal 互连用金属
metal silicide interconnection 金属硅化物互连 ; 金属
metal film interconnection [电子] 金属膜互连
Denotation of fractional dimension in metal interconnection electromigration is established and the quality relationship of fractal dimension for time series, electron path and grain boundary.
该模型表明，在金属互连电迁移前期，时间序列的分形维数逐渐增大；成核后，噪声时间序列的分形维数减小；成核时刻是其转折点。
参考来源 - 金属互连电迁移噪声分形表征参量研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Electromigration in metal thin film interconnection is one of the important problems for VLSI reliability.
金属薄膜互连的电迁移现象是VLSI最重要的可靠性问题之一。
Metallization is the process of depositing a thin film of metal and patterning it to form the desired interconnection arrangement.
金属化是淀积一层薄薄的金属膜的工艺，将其制成模版用于形成所需的内部互连排列。
Method for reducing metal, multilayer interconnection structure and manufacturing method for the same, and semiconductor device and manufacturing method for the same.
金属还原方法，多层互连结构及制法，半导体器件及制法。
应用推荐