... 金属半导体接触 metal-semiconductor contact 金属半导体势垒 metal-semiconductor barrier 金属棒 metal bar; billet ...
基于4个网页-相关网页
metal semiconductor barrier 金属 ; 金属半导体接触势垒 ; 半导体接触势垒
Electrons from the metal will have to surmount the potential barrier to enter the semiconductor.
金属中的电子必须克服这个势垒层才能进入半导体。
A semiconductor device (10) has contact between the last interconnect layer (16) and the bond pad that includes a barrier metal (26) between the bond pad (28) and the last interconnect layer (16).
一种半导体器件(10)，具有在最后的互连层(16)和接合焊盘之间的接触，该接合焊盘包括接合焊盘(28)和最后的互连层(16)之间的阻挡金属(26)。
Schottky Barrier Diode (SBD) is based on the rectification characteristics of metal-semiconductor contact.
肖特基势垒二极管是利用金属半导体的整流接触特性而制成的二极管。
应用推荐