At last, the trends of MEMS and MEMSpackaging are prospected, and the integrated MEMS system packaging is discussed.
最后对MEMS和MEMS封装的走向进行了展望，并对全集成MEMS系统的封装进行了一些探讨。
Potting is a key step for the packaging of high-g micro-electro-mechanical system(MEMS) accelerometer.
灌封是高量程微机械加速度计实用化的一个关键步骤。
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