The Angle deflection, buckling stress of insulator, horizontal load and vertical load were recorded. The mechanical failing load test was performed on buckling insulator.
监测了角度偏移、受压复合绝缘子的应力及水平荷载和垂直荷载，并在多次试验后对受压绝缘子进行了机械破坏负荷试验。
The heat treatment process of 7005 alloy is studied in terms of mechanical properties and resistance to stress corrosion test.
通过力学性能以及抗应力腐蚀的测定，对7005铝合金的热处理工艺进行了研究。
The methodologies for free drop test and bending test are introduced, considering the important effect of mechanical stress on the reliability of lead-free BGA packaging.
着重研究了机械冲击和应力对无铅BGA 封装焊点可靠性的影响，介绍了BGA 封装的可靠性力学试验（跌落、弯曲试验）及其分析方法。
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