3D material removal model 材料去除三维模型
Based on this mechanism, a new mathematical model characterizing the material removal rate in CMP process was developed by using micro-contact mechanics and particle size distribution theory.
基于这种机理，应用微观接触力学和磨粒粒度分布理论建立了一种新的表征CMP过程材料去除速率的数学模型。
The dissertation also constructs the inference and evaluation system of the model of material removal volumes. The recognition algorithm of material removal volumes is advanced.
本文同时建立了材料去除形素体积模型的推理和评价系统并提出了从模型中识别材料去除形素体积的算法。
This article analyses the material - removal mechanisms in grinding ceramics, and advertences the grinding model of ceramics semi - ductile regime grinding.
对氮化硅陶瓷磨削表面进行实验观察，从理论上分析了陶瓷材料的加工机理，提出了陶瓷的半延展性磨削模型。
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