Based on this mechanism, a new mathematical model characterizing the material removal rate in CMP process was developed by using micro-contact mechanics and particle size distribution theory.
基于这种机理，应用微观接触力学和磨粒粒度分布理论建立了一种新的表征CMP过程材料去除速率的数学模型。
This product is corrosive small, can not stop cleaning, removal of micro-scale, high efficiency, easy-eluting material deposition.
本产品腐蚀小，可以不停产清洗，去除微生物垢效率高、洗脱物不易沉积。
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