Main technical requirements: Details please see in Section 8 Schedule of requirement and technical Specifications.
主要技术参数：详细内容，见第八章货物需求一览表及技术规格。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
The function of intermission valve in intermission convey system and main technical requirements of sphere core are introduced. The key process for sphere core's making is studied.
简要介绍了间歇阀在间歇式输送装置中的作用以及球面阀芯的主要技术要求，探讨了球面阀芯关键部位的加工工艺。
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