The system include pulse cathodic arc ion deposition, direct current cathodic arc ion deposition, magnetic sputtering and electronic beam evaporation technologies.
该系统集脉冲阴极弧离子镀、直流阴极弧离子镀、磁控溅射和电子束蒸发等镀膜工艺以及气体和金属离子注入于一体。
The transverse component of magnetic flux intensity is pivotal that affect the utilization rate of target material and quality of deposition film as well as the instability of the sputtering process.
利用有限元理论对靶表面磁通量密度的横向分量进行了模拟分析。
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