tin-lead plating 电镀铅锡
tin lead plating 镀锡铅合金
electroless lead plating bath 化学镀铅
lead-tin alloy plating 镀铅锡合金
lead-tin alloys plating 电镀铅锡合金
tin-lead alloy plating 电镀锡铅合金
After extraction separation of gold by MIBK, lead, copper, iron, nickel in gold plating bath were determined by inductively coupled plasma-atomic emission spectrometry (ICP-AES).
研究了甲基异丁基酮(MIBK)萃取分离金，用电感耦合等离子体原子发射光谱法(ICP AES)测定镀金液中杂质元素的新方法。
No practicable substitutes for lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body are available.
以硼酸锌玻璃体为基础的高压二极管的电镀层的铅的替代品仍然不切实际。
Through-thickness cracking also can lead to fatigue or stress corrosion cracking of the base metal beneath the plating.
还会形成穿透型裂纹，造成镀层下本体金属的疲劳或应力腐蚀裂纹。
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