No practicable substitutes for lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body are available.
以硼酸锌玻璃体为基础的高压二极管的电镀层的铅的替代品仍然不切实际。
The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.
引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。
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