In addition, Thermal Force-Directed Placement Algorithm is used, detailed analysis of the device optimized layout of the component junction temperature and the average PCB temperature are shown.
另外，本文还运用热力导向优化算法，分析了电子元器件的优化布局对元器件的结点温度的影响。
We’re replumbed the internals of the layout system so component layouts are radically faster.
我们重新调整了布局系统的内部机制，现在组件的布局速度大幅提升。
The following sections discuss the basic mechanism of theme customization and cover advanced scenarios of making changes to theme layout and new component integration.
下面的章节将讨论主题定制的基本机制，以及修改主题布局和新组件整合的高级场景。
应用推荐