This paper overviews the application of laser interferometer in the precision analysis of semiconductor process equipment. The laser straightening effecting on linear measuring is introduced.
概述了激光干涉仪在半导体工艺设备精度分析领域的应用，简单介绍了光路准直对线性测长的影响。
In the process of duplicate laser boring, the crosswise pattern of laser beam determines the precision of the processing hole's shape and size.
在复制法激光打孔中，激光束的横向模式决定着加工孔的形状和尺寸精度。
The paper compares the laser light strip geometric center extraction process method and the skeleton method, and adopts the skeleton method whose thinning precision is much higher.
本文通过对比激光几何中心提取法及骨架法，使用了细化精度更好的骨架法。
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