Laser localized bonding is an important technology to reduce the high temperature adverse effect in bonding process.
激光局部键合是有效降低键合温度的一种重要工艺。
In the design of the semiconductor laser groupware, selection of lasers, design of an optical system and a laser circuit and the bonding technology are key factors.
在半导体激光器模组设计中，激光器选择、光学系统设计、激光器电路设计与“邦定”技术是模组设计的关键部分。
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