热阻参数Parameter Symbol Package MAX UNIT热阻(Junction to Ambient) 热阻(Junction to Case)θJA θJcTSSOP28 TSSOP2845 8°C/W °C/WShanghai Mixinno Microelectronics Co., Ltd ?
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In this case, they are used to make "multi-junction" solar cells, in which each layer captures energy from a particular colour in the spectrum of sunlight.
在这个例子中，纳米材料被用来制造“多结”太阳能电池，每一层都对应捕捉光谱中的一种颜色的能量。
Hitachi, Lucas, and other "chip" diodes are prone to fracture at the junction of the stem to the case of the chip.
日立，路克斯和其他“芯片”二极管主干与芯片盒的接缝容易开裂。
The factors affecting the junction-to-case thermal resistance of the module are studied according to the simulation results.
根据该热模型分析了评价集成模块热性能的主要参数——模块的结壳热阻的构成情况和影响因素；
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