A numerical model was designed to simulate the kinetic process of diffusion and reaction of one reactant with another on the interface of droplets in a gelatin layer.
设计了一个数值模型来模拟一个反应物在明胶层中边扩散边在油珠界面上与另一个反应物反应的动力学过程。
The affecting factors on interface diffusion and migration of Cu and Ni powders have been investigated during the process of Cu Ni solid solution which be formed by reaction of Cu and Ni powders.
研究了在铜粉和镍粉反应形成固溶体组织的过程中，影响铜粉和镍粉界面扩散和迁移的因素。
Diffusion bonding results indicate that the interface situation is different merely by a cold drawing and then a diffusing process.
研究结果表明，冷变形后不同温度下扩散处理的复合界面状况存在差异。
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