When the annealing temperature was higher than 350℃,the interdiffusion in Cr/Ag interface was observed. When the annealing temperature exceeded 550℃ the Cr atom outward diffused to the surface across the Ag layer.
实验结果表明:当退火温度达到350℃时,Cr/Ag界面开始互扩散;当退火温度超过550℃,大量铬原子通过银层向试样表面扩散。
参考来源 - 热退火对银/铬薄膜界面结构的影响·2,447,543篇论文数据,部分数据来源于NoteExpress
In both sides of the bonded interface, the interdiffusion of components was evident.
结合界面两侧元素相互扩散的趋势明显。
Expressions for interdiffusion coefficients were derived in the literature, but they are all based on the concentration gradient.
关于二元合金互扩散系数的表达式,虽然有过推导,但是在推导过程中都是以扩散组元的浓度梯度为出发点。
Interdiffusion of thin film Au in metallic Sn at room temperature is observed by light microscope on fresh electroplated multilayer surface.
在刚形成的电镀多层结构表面上用光显微镜观察室温下在金属锡上形成的金的扩散薄膜。
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