In this thesis, the application of the failure analysis in MCP package technology will be addressed along with some general fa instrument and methods.
本文将主要讨论现阶段一般的封装失效分析的技术与设备，并且重点研究失效分析技术在多芯片封装领域的应用。
Based on the theory of signal analysis. Make use of the technology of virtual instrument and modularized hardware to design all-purpose test bench of virtual with the help of computer.
以信号分析理论为基础，采用虚拟仪器技术，辅以多参量数据采集模块化硬件，设计了基于微机的虚拟综合测试台。
The food texture analysis instrument was improved based on LabVIEW which combined with the computer sys-tem integration and single chip technology to set up food texture detecting system.
采用虚拟仪器技术、机电一体化技术、单片机技术、传感器技术于一体，研制了食品物性参数的自动检测和分析系统。
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