The inner layer depicts a pattern similar to a distorted view of clouds moving through the sky.

里层模仿类似于穿过天空的云层扭曲景象。

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Add some effects to this layer: Drop Shadow, Inner Shadow, Inner Glow, Pattern Overlay and Gradient Overlay.

在这个图层上添加一些效果：投影，内阴影，内发光，图案叠加和渐变叠加。

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The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.

图案化金属层位于绝缘层上并填入于导通孔中，以作为本实用新型多芯片封装结构的内连线层。

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