The contact resistance is stable because of enough gold accumulating in the contact area.
由于接触区域内有足够金存在,接触电阻变化趋势比较平稳。
Excessive current through the contacts during testing can cause a physical change in the contact area on a microscopic level.
在测试时流过接点的电流过大也能使接触区域发生细微的物理变化。
This was due to the increase in the contact area at the tool-chip and tool-work interface due to the presence of flank and crater wear.
这是由于增加了接触面的工具,芯片和工具的工作界面因侧翼和火山口的磨损。
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