An experimental platform of the IC die bonder has been manufactured, and parameters such as moving precision and position accuracy have been measured by using image recognition technology.
设计制造出IC芯片粘片机焊头机构的实验平台，采用图像处理的方式来测量焊头的运动精度和定位精度等参数。
The license plate region is positioned by disposing the high frequency image created by wavelets operationthis arithmetic enhances the position velocity and accuracy.
将分解出的高频图像经过后继处理即可定位出车牌，这种算法不仅提高了车牌定位的速度，而且大大提高了定位的准确率。
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