The invention can realize the nondestructive copy, extend the operating life of the master C. D. and selecting the large numerical aperture to meet the requirement for copying C. D. with high density.
本发明可以实现无损复制，提高母盘的使用寿命，选用大的数值孔径，满足高密度光盘复制的需要。
This makes electroforming the preferred technique for high-density applications such as wafer bumping, where aperture counts are now more than 2 million.
这使电铸成为高密度应用，比如晶片封装优选技术。
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