This paper introduces the original struchure and principle of the bondhead device for high speed die bonder designed by author.
本文介绍作者设计的高速芯片焊接机焊头的独特结构和工作原理，并给出了主要设计参数和计算公式。
The auto Die Bonder for SOT - 23 transistor is a high - speed, high - precision, machinery electronics integrated equipment.
23晶体管封装自动键合机是高速、高精度机电一体化精密设备。
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